• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a device for bonding a second substrate (5) to a first substrate (2) with the following features: - Bonding layer (3) received second substrate (5), - a loading device for loading the second substrate (5) on a loading side (5o) facing away from the bonding layer (3) of the second substrate (5) with a bonding force starting from one within an edge zone R. the exit zone A lying on the loading side (5o) up to the loading on the entire loading side (5o). The present invention further relates to a corresponding method.
    公开号:AT16646U1
    申请号:TGM8036/2019U
    申请日:2013-11-05
    公开日:2020-04-15
    发明作者:Burggraf Jürgen
    申请人:Ev Group E Thallner Gmbh；
    IPC主号:
    专利说明:

    description
    DEVICE AND METHOD FOR BONDING The invention relates to a device for bonding according to claim 1.
    [0002] In the semiconductor industry, product wafers are increasingly being temporarily bonded to carrier wafers. The adhesive, the so-called bonding adhesive, is applied to the product wafer and / or the carrier wafer in the form of a layer with a layer thickness that is as homogeneous as possible. After the coating process, however, both wafers must be pressed together with high forces. This process is known as bonding. The printing plates used, which apply pressure to the two wafers, should, according to the current state of the art, be flat in order to apply a bonding force which is as uniform as possible everywhere. The printing plates are also manufactured accordingly. The lower plate is made as a support part of a bond chuck, i.e. a sample holder. The top plate is called the pressure plate and is mounted accordingly on the top of the bond chamber.
    The document US 2012/0103533 A1 discloses a bonding device with an upper and a lower receiving device. The upper receiving device is convexly bent in a central region when it is pressurized.
    After a product and / or carrier wafer has been coated with a conventional spin coating method (spin coating), a so-called “edge bead” usually occurs at the edge of the layer due to rheological and fluid dynamic properties. This "edge-bead" is a material accumulation that can be found on a circular substrate, a wafer, along the entire edge. The difference between the material thickness in the center and the material thickness at the edge is only a few micrometers, sometimes even only a few nanometers. When bonding, that is to say when the bonding force is applied, the problem of an uneven bonding force and / or a pressing out of the excess or excess adhesive often arises from this.
    Ideally, a layer for the bonding process according to the invention has a homogeneous thickness. In this context, homogeneous thickness means that the thickness of the bond layer is the same at every position or is within an acceptable tolerance. Experience shows, however, that even under ideal bonding conditions, i.e. in the case of a homogeneous layer thickness of a perfectly flat pressure plate, a perfectly even bond chuck, as well as a homogeneous, even pressure application, a layer with an inhomogeneous thickness can be present after the bonding process. The reason for this is the rheological and fluid dynamic properties of the layer as well as the prevailing initial and boundary conditions of the physical problem. Since the material in the center cannot spread in the plane as quickly as the material at the edge of the substrate, there is an increased flow velocity near the edge. You could say that the material in the center hampers itself, whereas the edge material can flow freely outwards. The situation would deteriorate correspondingly for a layer with a corresponding “edge bead”, since in this case there is even more material per unit area at the edge than in the center.
    The object of the present invention is therefore to further develop the generic devices and methods for bonding such that the problems mentioned of the inhomogeneous layer thickness are prevented or at least reduced.
    This object is achieved with the features of claim 1. Advantageous developments of the invention are specified in the subclaims.
    In the further course, a distinction is made between a product substrate and a substrate in order to illustrate the embodiment according to the invention. Product substrate and substrate can be interchanged and / or combined with one another as desired, so that, for example, substrate substrate, product substrate product substrate, substrate product sub / 10
    AT 16 646 U1 2020-04-15 Austrian patent office strat or product / substrate combinations are conceivable. Furthermore, lacquering of the carrier substrate is also conceivable. A first substrate can be the substrate, for example a carrier substrate. A second substrate can be the product substrate.
    The basic idea of the present invention is to carry out the application of the product substrate with a bonding force on an application side of the product substrate facing away from the bond layer, starting from an exit zone A lying within an edge zone R of the application side. In other words: First of all, the product substrate, particularly due to the shape of a pressure transmission side of the application device, is pressed onto the bond layer within the exit zone A (the product substrate in the region of the edge zone at least partially already on a bead created by applying the bond layer - so-called “edge -bead “- can lie on the bond layer, if this bead is present).
    One idea of the invention is to initiate the pressurization in the center of the bond layer, where the material of the bond layer is completely surrounded on the side by further material of the bond layer, so that the material in the center is subject to a flow restriction due to the prevailing boundary conditions. According to the invention, this results in an optimal possibility of connecting the two wafers to one another, since a so-called “squeeze-out”, that is to say an (uncontrolled and excessive) pushing out of the bonding material, is prevented or at least reduced. In the case of an existing “edge bead”, the product wafer deposited on the bond layer is bent according to the invention by the application device to the center of the bond layer and thus prevents the premature transmission of force from the application device to the “edge bead” by its elastic deformation.
    One aspect of the present invention is to provide a design solution for a pressure plate, with which it is possible according to the invention, the force transmission in the center, in which, due to the boundary conditions, the material which is difficult to flow is located, to focus and start.
    According to an advantageous embodiment of the present invention, it is provided to equip the loading device with a pressure plate with a convexly curved pressure transmission side. With a pressure transmission side that is particularly closed over the entire surface, a uniform application of pressure is possible. The pressure plate on its pressure transmission side is in particular non-adhesive.
    It is particularly advantageous if the tangential plane of the pressure transmission side curved according to the invention is at least 5 nm and / or a maximum of 500 μm, in particular at least 20 nm and / or a maximum of 200 μm, preferably at least 50 nm and / or maximum by 50 μm, more preferably at least 100 nm and / or a maximum of 5 μm in the normal direction to an imaginary plane of an ideally planar pressure transmission side. It is particularly advantageous if the curvature is concentric. In this way, the pressure plate can be rigid on the one hand and unyielding with the applied bonding force, whereby due to the very small curvature with a very large radius of curvature, only a minimal bulge is provided, through which the bonding layer is leveled or panarized from the inside out and, on the other hand, a corresponding concave, slight curvature also arises in the bond layer.
    By arranging the exit zone A concentrically to the product substrate side, the most uniform possible bonding result can be achieved.
    [0015] An embodiment is particularly preferred in which the application device has a stamp which applies the bonding force in a controlled manner by a control device. The stamp is connected to the printing plate, preferably interchangeably, so that different printing plates can be used for the respective requirements. It can advantageously be provided according to the invention that the shape of the bond
    2/10
    AT 16 646 U1 2020-04-15 Austrian patent office layer, especially at the edge zone R, is measured in order to select a suitable printing plate.
    According to a further advantageous embodiment of the invention it is provided that the printing plate is formed from a lower plate comprising the pressure transmission side and from a holding plate which fixes the printing plate, in particular in the region of a periphery P via fixing means. In this way, a printing plate with the properties described above, in particular only a slight curvature, can be produced in a particularly simple and exact manner.
    It is particularly advantageous if the lower plate in the area of the exit zone A is thicker than at the periphery P.
    Alternatively, a spacer is arranged between the lower plate and the holding plate in the area of the exit zone A, so that in this case the lower plate can also have two parallel flat sides and is therefore easier to manufacture. The lower plate is more elastic than the upper holding plate, which is particularly rigid.
    In a further alternative embodiment, a curvature element which acts on the lower plate in relation to the holding plate in the region of the exit zone A, in particular controlled by the control device, is arranged to adjust the curvature of the pressure transmission side. In this way, not only can the curvature be set once, but there can even be active control of the curvature during the approach and during the bonding.
    It is particularly provided according to the invention to set the radius of curvature of the printing plate or to select a printing plate suitable for the wafer with a specific radius of curvature.
    The printing plate according to the invention can be made of any material. However, it has been shown that materials with high E-moduli and high hardness values show particularly good bond results. The following materials are preferably used for the printing plate • ceramics, in particular silicon nitride (Si 3 N 4 ), silicon carbide (SiC) and / or boron nitride (BN) and / or • metals and their alloys in general, refractory metals in particular steels and / or other iron-based materials and / or • graphite and / or • glass and / or • glass and / or • polymers and / or • composite materials. Further advantages, features and details of the invention result from the description of preferred exemplary embodiments and from the drawings. These show in:
    Figure 1 2 shows a cross-sectional view of a first step of an embodiment of the method according to the invention, Figure 2 2 shows a cross-sectional view of a second step of an embodiment of the method according to the invention, Figure 3 2 shows a cross-sectional view of a third step of an embodiment of the method according to the invention, Fig. 4 2 shows a cross-sectional view of an embodiment of the method according to the invention at the start of bonding,
    3/10
    AT 16 646 U1 2020-04-15 Austrian patent office
    Figure 5 2 shows a cross-sectional view of an embodiment of the method according to the invention during bonding, Figure 6 2 shows a cross-sectional view of an embodiment of the method according to the invention at the end of bonding, Figure 7 2 shows a cross-sectional view of a first embodiment of a printing plate according to the invention, Fig. 8 2 shows a cross-sectional view of a second embodiment of a printing plate according to the invention, Figure 9 2 shows a cross-sectional view of a third embodiment of a printing plate according to the invention,
    In the figures, the same or equivalent components are identified by the same reference numerals.
    In the following, a process according to the invention is described which uses a printing plate according to the invention to carry out a controlled bonding process. The process according to the invention is represented on an adhesive layer with “edge bead”. However, the process according to the invention can also be carried out on a bond layer with a homogeneous layer thickness, that is to say without an “edge bead”. The control takes place via a control device, not shown, in particular software-supported.
    In a first step (FIG. 1), a coating material (in particular temporary adhesive) is applied as a bonding layer 3 on a substrate 2 (in particular a wafer). The coating takes place in an industrial coating system. When the bond layer 3 is produced by means of a spin coating process, a peripheral bead 3w is often formed in an edge zone R, which is characterized by a, in contrast to the average layer thickness D 1; characterized increased thickness D 2 .
    In a second process step, the wafer 2 coated with the bond layer 3 is transported into a bonding system and placed on a receiving device 1, in particular a sample holder (bond chuck). The product substrate 5 (second wafer) to be bonded to the substrate 2 is brought into contact with the bonding layer 3 (FIG. 2). In a bond chamber (not shown), spacers, so-called “flags”, are used, for example, to initially keep the product substrate 5 separated from the surface 3o of the layer 3 until a complete evacuation of the bond space through a bond chamber (not shown) connected to the bond chamber Vacuum system has taken place.
    [0036] In a further step according to the invention, the bond chamber is closed. As a result, a pressure plate 6, in particular attached to the cover of the bonding chamber, is positioned above the product substrate 5. The printing plate 6 according to the invention has a convex curvature with a radius of curvature r facing the product substrate 5. For the printing plate 6, several embodiments according to the invention are shown in FIGS. 7 to 9.
    In a fourth process step according to the invention according to FIG. 4, the product substrate 5 is first touched by the convex pressure plate 6 according to the invention in a, in particular punctiform, exit zone A, preferably exactly in the center of the product substrate 5, and is accordingly subjected to a bonding force. As a result of the convex shape of the pressure plate 6 according to the invention, the edge zone R of the layer 3 is not subjected to any significant pressure in this process step (at most via a negligible tension and weight of the product substrate 5). When an edge bead is present, the pressurization onto the center of the wafer 5 initially only leads to a deflection of the product substrate 5 in the direction of the bonding layer 3.
    Due to a continuous relative movement of the pressure plate 6, in particular normal, towards the receiving device 1, the center of the product substrate 5 is guided ever closer to the surface 3o of the bonding layer 3, and without any appreciable increase in the compressive stress on the edge zone R. Only with the Contact of the convexly curved pressure plate 6
    4/10
    AT 16 646 U1 2020-04-15 Austrian patent office with a periphery P of the product substrate 5, pressure is transferred with a bonding force to the edge zone R of the bonding layer 3.
    This is particularly the case when the tangential plane of the pressure transmission side 6u is at least 5 nm and / or a maximum of 500 μm, in particular at least 20 nm and / or a maximum of 200 μm, preferably at least 50 nm and / or maximum by 50 μm, more preferably at least 100 nm and / or a maximum of 5 μm in the normal direction to the tangential plane. Preferably, the pressure plate 6, in particular after a determination of the height of the bead 3w, is selected or set such that the distance from the tangential plane to the pressure transmission side 6u is on a peripheral edge of the pressure plate 6 of the (in particular mean) height (H = D 2 - D ^ corresponds to the bead.
    In the case of a non-existing “edge beads”, the product wafer 5 lies flat on the bonding layer 3 and the force introduction and force transmission from the pressure plate 6 to the product wafer 5 takes place without prior bending of the product wafer 5.
    Through a further increase in pressure, an ever larger part of the pressure plate 6 contacts the product substrate 5 and thus distributes the force over the entire application side 5o as the approach increases.
    In both cases, however, the material in the center is prevented from flowing more than the material at the edge. The reduced fluidity of the material in the center is explained by the fact that its fluidity in the radial direction is hindered by material located further out and in the normal direction by the pressure plate. In other words, since the application side 5o is first subjected to a corresponding force in the center, a force is indeed transmitted, but this leads to the material in the center not flowing appreciably. The edge is not yet flowing at this point in time, since the corresponding force has not yet been distributed over the entire loading side 50.
    The process flow according to the invention forms an almost completely leveled surface 3o ’, which no longer has a bead 3w, but at the same time also has no prematurely and uncontrolled displaced material at the edge. The concave negative of the layer 3 ’produced by the convex pressure plate 6 has a small, if not negligible, deviation in planarity compared to the untreated bond layer 3. However, this deviation from the planarity is negligible due to the very large radius of curvature r of the printing plate 6 according to the invention and is practically not relevant for further processing, especially since the advantage of the leveling of the bonding layer 3 according to the invention predominates.
    Furthermore, the following embodiments of the pressure plate 6 according to Figures 7 to 9 are disclosed.
    Common to all three embodiments is the design of the printing plate 6 from several components, namely:
    - A lower plate 9 and the pressure transmission side 6u
    a holding plate 4 for holding / fixing the lower plate 9 via fixing means 8 located in the region of the periphery P.
    In a first embodiment, the pressure plate 6 is already convex and connected to a holding element 4 via the fixing means 8 on its upper side 90.
    In a second embodiment, a planar lower plate 9, which is connected by the fixing means 8 on its upper side 9o to the holding plate 4, is brought into a correspondingly convex shape by a spacer 7 by the lower plate 9 being more flexible than the, in particular rigid, holding plate 4. The spacer 7 is preferably circular. It has a thickness of less than 5 mm, with preference less than 1 mm, with greater preference less than 100 μm, with even greater preference less than 1 gm, with greatest possible preference less than 100 nm.
    In a third embodiment, a curvature element 10 is used to the
    5/10
    AT 16 646 U1 2020-04-15 Austrian patent office
    To apply pressure to the center of the lower plate 9, which is connected to the holding element 4 by means of fixing means 8 on its upper side 9o. By applying pressure to the center of the pressure plate 6 with a curvature pressure, the convex curvature of the pressure plate 6 can be changed continuously or set once. The elasticity of the pressure plate 6 is preferably so great that when the center of the pressure plate 6 is relieved by removing the curvature element 10, the pressure plate 6 is automatically deformed back into a planar starting position. A corresponding embodiment is conceivable according to the invention, in which the curvature element 10 is connected to the lower plate 9 and permits an appropriate active control of the radius of curvature of the pressure plate 6.
    6/10
    AT 16 646 U1 2020-04-15 Austrian patent office
    REFERENCE SIGN LIST
    1 Reception facility 2nd Substrate 3rd Bond layer 3o, 3o ’ surface 3w bead 4th Retaining plate 5 Product substrate 5o Loading side 6 printing plate 6u Pressure transmission side 6o Top 7 Spacer 8th fixer 9 lower plate 10th Curvature element A Exit zone Tue, D 2nd thickness R Edge zone P Periphery r Radius of curvature H height Z center
    7/10
    AT 16 646 U1 2020-04-15
    权利要求:
    Claims (7)
    [1]
    Expectations
    1. Device for bonding a second substrate (5) to a first substrate (2) with the following features:
    a receiving device (1) for receiving the first substrate (2) coated with a bonding layer (3) and the second substrate (5) received on the bonding layer (3),
    - A loading device for loading the second substrate (5) on a loading side (5o) facing away from the bonding layer (3) of the second substrate (5) with a bonding force starting from an exit zone A lying within an edge zone R of the loading side (5o) until loading the entire loading side (5o), the loading device having a rigid pressure plate (6) with a convexly curved pressure transmission side (6u), the pressure plate comprising a lower plate (9u) comprising the pressure transmission side (6u) and a pressure plate (6), in particular in the region of a periphery P via fixing means (8), fixing holding plate (4).
    [2]
    2. Device according to claim 1, wherein the tangential plane of the pressure transmission side (6u) at least by 5 nm and / or at most by 500 μm, in particular at least by 20 nm and / or at most by 200 μm, preferably at least by 50 nm and / or maximum by 50 μm, with greater preference at least 100 nm and / or a maximum of 5 μm in the normal direction to an imaginary plane of an ideally planar pressure transmission side.
    [3]
    3. Device according to one of the preceding claims, wherein the exit zone A is arranged concentrically to the loading side (5o).
    [4]
    4. Device according to one of the preceding claims, in which the application device has a stamp which applies the bonding force in a controlled manner by a control device.
    [5]
    5. The device according to claim 1, wherein the lower plate (9) in the region of the exit zone A is thicker than at the periphery P.
    [6]
    6. The device according to claim 1, in which a spacer element (7) is arranged between the lower plate (9) and the holding plate (4) in the region of the exit zone A.
    [7]
    7. The device according to claim 1, in which the lower plate (9) opposite the holding plate (4) in the region of the exit zone A with a curvature pressure, in particular controlled by the control device, curvature element (10) for adjusting the curvature of the pressure transmission side (6u ) is arranged.
    类似技术:
    公开号 | 公开日 | 专利标题
    DE102008044200B4|2012-08-23|Bonding method
    AT506622B1|2016-01-15|DEVICE AND METHOD FOR APPLYING AND / OR DISCONNECTING A WATER TO / FROM A CARRIER
    DE102004030612B3|2006-04-20|Semiconductor substrate and method for its production
    DE10323302A1|2004-04-15|Composite comprises thin substrate | less than 0.3 mm thick releasably bound to carrier substrate having fine structuring with open, infinitesimal cavities, useful in e.g. display industry, polymer electronics, and biotechnology
    DE102007001133B4|2008-09-04|Method and device for breaking thin glass panes
    AT503848A2|2008-01-15|HANDLING DEVICE AND HANDLING METHOD FOR WAFER
    DE2462565A1|1977-09-15|PROCEDURE FOR FASTENING SEMI-CONDUCTOR WORKS ON A MOUNTING PLATE
    WO2013023708A1|2013-02-21|Apparatus and method for bonding substrates
    DE10008111A1|2001-08-23|Device for vacuum pressing DVD substrates
    DE102005060907B4|2007-09-13|A process for producing a glass sheet with defined protrusions and mold for use in such a process
    DE102005045718B4|2009-06-25|Carrier for a substrate
    DE10227823A1|2003-09-04|Electronic apparatus for manufacturing liquid crystal display device comprises unitary vacuum processing chamber, upper and lower stages confronting each other at upper and lower spaces, and first substrate lifting system
    AT16646U1|2020-04-15|Device and method for bonding
    DE102014206375A1|2015-10-08|Method and device for joining components, at least one of which is formed from a fiber-reinforced plastic
    EP2450175A2|2012-05-09|Device for uniformly structuring substrates
    EP1332516A1|2003-08-06|Method for applying a substrate
    EP0258353A1|1988-03-09|Article with adhesive coating and process for its production
    WO2011120537A1|2011-10-06|Method for producing a wafer equipped with chips on two sides
    EP2380746B1|2013-12-11|Embossing stamp and hot embossing method
    DE102012213071A1|2013-07-11|Method for producing toughened substrate e.g. pre-stressed glass substrate used in e.g. smart phone, involves separating substrate along trench provided on two sides of substrate
    AT516095B1|2016-05-15|Apparatus for producing a lens wafer
    EP2742527B1|2021-07-28|Apparatus and method for bonding substrates
    WO2021089173A1|2021-05-14|Device and method for connecting substrates
    WO2021110237A1|2021-06-10|Method and apparatus for removal of a stamp
    DE102005061453A1|2007-06-28|Fastening for an ink plate at a plate cylinder, in a printing press, has a friction unit between the clamping surface of the upper clamping bar and the forme carrier of the ink plate
    同族专利:
    公开号 | 公开日
    JP6053946B2|2016-12-27|
    AT517639A5|2017-03-15|
    US10943810B2|2021-03-09|
    US20150279715A1|2015-10-01|
    KR20150088248A|2015-07-31|
    TWI636512B|2018-09-21|
    CN104781921B|2017-11-28|
    KR102211333B1|2021-02-03|
    CN104781921A|2015-07-15|
    TW201438116A|2014-10-01|
    DE102012111246A1|2014-05-22|
    JP2016504760A|2016-02-12|
    WO2014079677A1|2014-05-30|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    EP0256150A1|1986-08-13|1988-02-24|Kabushiki Kaisha Toshiba|Apparatus for bonding semiconductor wafers|
    JPH0582493A|1991-03-11|1993-04-02|Hitachi Ltd|Wafer bonding device and method of bonding wafer using the device|
    EP0899778A2|1997-08-27|1999-03-03|Canon Kabushiki Kaisha|Apparatus and method for pressing two substrates together|
    US20080279659A1|2007-05-07|2008-11-13|Lintec Corporation|Transferring device and transferring method|
    US20120103533A1|2010-10-29|2012-05-03|Tokyo Electron Limited|Bonding apparatus and bonding method|
    US20120186741A1|2011-01-26|2012-07-26|Aptina Imaging Corporation|Apparatus for wafer-to-wafer bonding|
    JP2945089B2|1990-07-05|1999-09-06|古河電気工業株式会社|Tape sticking device for wafer|
    JP2910334B2|1991-07-22|1999-06-23|富士電機株式会社|Joining method|
    JP2678161B2|1991-10-30|1997-11-17|九州電子金属株式会社|Vacuum bonding equipment for semiconductor wafers|
    JPH09320913A|1996-05-30|1997-12-12|Nec Kansai Ltd|Wafer joining method and device therefor|
    US6383890B2|1997-12-26|2002-05-07|Canon Kabushiki Kaisha|Wafer bonding method, apparatus and vacuum chuck|
    JP4051125B2|1998-03-25|2008-02-20|不二越機械工業株式会社|Wafer bonding equipment|
    JP4614626B2|2003-02-05|2011-01-19|東京エレクトロン株式会社|Manufacturing method of thin semiconductor chip|
    JP5281739B2|2006-07-18|2013-09-04|新光電気工業株式会社|Anodic bonding equipment|
    JP4841412B2|2006-12-06|2011-12-21|日東電工株式会社|Substrate laminating equipment|
    DE102006058493B4|2006-12-12|2012-03-22|Erich Thallner|Method and apparatus for bonding wafers|
    JP2008182016A|2007-01-24|2008-08-07|Tokyo Electron Ltd|Sticking apparatus and method|
    KR20100043478A|2008-10-20|2010-04-29|삼성전기주식회사|Electrostatic chuck and apparatus for attaching substrate using the same|
    DE102008044200B4|2008-11-28|2012-08-23|Thin Materials Ag|Bonding method|
    DE102009018977A1|2009-04-25|2010-11-04|Ev Group Gmbh|Device for aligning and prefixing a wafer|
    EP2706562A3|2009-09-01|2014-09-03|EV Group GmbH|Device and method for releasing a semiconductor wafer from a carrier substrate by tilting a film frame|US10872874B2|2018-02-26|2020-12-22|Taiwan Semiconductor Manufacturing Company, Ltd.|Bonding apparatus and method of bonding substrates|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DE102012111246.0A|DE102012111246A1|2012-11-21|2012-11-21|Apparatus and method for bonding|
    ATA9382/2013A|AT517639A5|2012-11-21|2013-11-05|Apparatus and method for bonding|
    [返回顶部]